High Temperature Memory Devices
For over 30 years Texas Microelectronics Corporation (TxMC) has successfully utilized various memory dies that successfully operate at temperatures ranging from 175°C to 230°C.
We use these memory devices in both Hybrid Multi-Chip modules, as well as packing die in a monolithic configuration, all depending upon our customer’s requirements.
Dual Memory Die within a Multi-Chip Module
Regardless of the application, MWD, Permanent Installation, battery operated sensor data collection, high-performance, high-temperature memory devices can get your project to successful competition.
Texas Microelectronics Corporation utilizes various memory devices such as DRAM, EEPROM, Flash, Serial I/O, Parallel I/O, etc.
How can we help you be more successful?